The American National Standards Institute (ANSI) encourages all relevant stakeholders, industry representatives, and standards-setting organizations to participate in two upcoming hybrid events hosted by the CHIPS Research and Development Office: the Semiconductor Supply Chain Trust and Assurance Standards Workshop, and the Digital Twin Data Interoperability Standards Workshop. Separate registrations are required for the two workshops. Register by March 28.
Findings from both workshops will be published in a post-workshop report and will inform standards planning efforts across the semiconductor innovation ecosystem and within the CHIPS R&D Office.
Semiconductor Supply Chain Trust and Assurance Standards Workshop, April 2-3
The first workshop is an opportunity to network and exchange ideas with thought leaders across the sector; participants are expected to collaborate and discuss key questions and topics that will shape future of data interoperability standards activities.
The workshop will feature plenary, panel, and interactive breakout sessions. It may cover questions including (but not limited to):
The workshop will be held as a hybrid virtual and in-person event, on April 2, 2024, from 8:30 p.m. to 5:30 p.m. ET, and April 3, 2024, from 8:30 a.m. to 12:30 p.m. ET. In-person attendance will take place at the National Institute of Standards and Technology (NIST) National Cybersecurity Center of Excellence (NCCoE) conference facility in Rockville, MD.
Relevant stakeholders, including domestic and international participants, are encouraged to apply.
Access more information on the Semiconductor Supply Chain Trust and Assurance Standards Workshop and register via NIST’s event page.
Digital Twin Data Interoperability Standards Workshop, April 4-5
Digital twins in manufacturing enable proactive decision-making, predictive maintenance, scenario testing, and collaboration among stakeholders. The second workshop will focus on standards needs for a specific use case: application of a digital twin for manufacturing in the chiplet - packaging module. Participants will examine the potential for digital twin technologies to drive progress in the semiconductor and microelectronics industry, and the role of data interoperability standards for digital twins in the semiconductor manufacturing ecosystem.
Session questions that will be considered include (but are not limited to):
The workshop will be held as a hybrid virtual and in-person event, on April 4, 2024, from 8:30 p.m. to 5:30 p.m. ET, and April 5, 2024, from 8:30 a.m. to 12:30 p.m. ET. In-person attendance will take place at the NIST NCCoE conference facility in Rockville, MD.
Find our more information on the Digital Twin Data Interoperability Standards Workshop and register on NIST’s website.
More on CHIPS Efforts
The workshops are the latest effort to bolster U.S. semiconductor research and manufacturing. They are an outcome of the CHIPS and Science Act, enacted in 2022, which seeks to improve America’s semiconductor capacity; promote domestic research and development; create regional tech hubs; and support a highly skilled and inclusive STEM workforce.
In December, the CHIPS Research and Development Office held a Chiplets Interfaces Technical Standards Workshop that examined the potential for chiplet-based architectures to drive progress in the semiconductor and microelectronics industry. A second related workshop focused on the potential for digital twin applications—including modeling, simulation, and co-simulation—to support reliable, resilient, and high-quality manufacturing processes and enable trusted supply chains.
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